What is the difference between Mingfa Tech’s COB heat sink and the heat sink that is not designed or produced by Mingfa Tech? Many people think that the larger the heat dissipation area or the larger the size of the heat sink, the better the thermal efficiency with the cob light source for passive cooling adopted. In fact, this is not the case. If the COB packaged chips are more concentrated, the heat is also more concentrated requiring sufficient thermal contact area to quickly help the heat sink core source to dissipate heat through passive cooling. And if the central conductive column of the heat sink is too large, the heat cannot be quickly transferred to the heat sink and a large amount of heat will be attached to the inside of the lamp, resulting in a large increase in temperature. Therefore, the heat on the COB source cannot be completely transmitted, and its service life will be rapidly reduced, potentially posing a potential safety hazard.
Therefore, we apply the active cooling technology to our heat sink. The purpose of the new COB heat sink of Mingfa Tech is to overcome the deficiencies in the prior art and to provide a heat dissipation device with a simple and reasonable structure, which is tightly combined with the circuit leads of the lamp. It has good sealing performance and good anti-corrosion, waterproof and dustproof effects. It can significantly improve the quality of the COB LED luminaire and extend its service life. The product has high and stable thermal conductivity and can be highly resistant to high temperatures. Therefore, it is highly recommended for wide promotion and application.