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it\'s all in the packaging

by:Mingfa Tech     2020-04-10
The ceiling of Ibiden Co is hung with fluorescent lamps, and the furniture is reminiscent of 1950.
The headquarters in the central Japanese town of Yamazaki looks high. tech hotbed.
Look across the road.
Ibiden\'s funds will enter a sparkling new factory worth $0. 115 billion to provide the world\'s most advanced microprocessor packages to unrecognized customers.
Customers can only be intel. Intel accounts for 80% of the world\'s microprocessor market, so it has the same market share of about $1 billion (Global sales)
Chip Packaging MarketWhy keep it secret?
Because integration
Circuit packaging is of strategic importance.
If the design is clever, they allow chip designers to package more computing power into a small space without causing the chip to fail.
Packaging Manufacturers work closely with chip companies to understand many of the secrets of future design.
For Intel Pentium II, this package is a square plastic with a thickness of about 30mm on one side and about gold.
It connects about 250 electronic entry points on Silicon silver to the same number of metal pins filled into the board.
This package is much more complicated than you think.
It can contain 8 to 12 layers, each with its own wiring.
It\'s cooling--
In the case of Pentium II running at a speed of 24 watts at 333 MHz.
A radiator may be needed for the chip to coollike heat sink.
First Quarter-
The century of microprocessor life, the most complete
The circuit package is a fairly predictable large piece of ceramics, mainly from one of the four Japanese companies: Kyocera (
Its name is a combination of Kyoto and ceramics)
, NGK Spark Plug, new section electronics industry, Sumitomo Metal Electronics. Why ceramics?
Mainly because they handle high temperatures well. -
And old chips that used to be very hot.
The trickiest thing about electronics is that when you solve one problem, you create another problem.
To make the packaging with ceramics, you have to ignite it like a pottery jar at extremely high temperatures.
Now you have a new problem.
High temperature will melt copper.
Therefore, your circuit line must be made of tungsten.
Now you have a problem.
So is ceramics.
High barrier of tungsten package-
Frequency signal.
It\'s not a problem with yore chips, it\'s a very big problem these days.
The latest Pentium II pulse speed is five times that of the first Pentium launched in 1993.
That is the cost.
Intel charges microprocessors ranging from $50 to $800, but may end up handing over 10% or more of its revenue to the packaging manufacturer.
Since Intel has reduced the size of its circuit from 1 to 1.
5 microns to 0 a few years ago.
The operating temperature of the latest Pentiums has dropped by 25 microns.
This in turn provides an opportunity to move from ceramic to plastic packaging that may be cheaper.
Unlike ceramics, plastic does not have to be fired at high temperatures or can be embedded in copper circuits. Copper-
Plastic combination is more suitable for highMhz chip
Until a few years ago, the plastic chip package was either unable to stand the heat emitted by the microprocessor, or it cost several times as much as the ceramic to get the necessary performance.
Ibiden decided to try to make the plastic packaging affordable.
This small Japanese dress with high spirits (
Sales of $0. 9 billion in the previous fiscal year)
To save its skin, it has been using technology.
Founded in 1912, Ibiden, located near the Ibi River, began to produce hydropower.
Demand for electricity dried up.
To survive, Ibiden created its own demand for fertilizer, carbon and ferrosilicon.
At 1960, the company was in trouble again. -
The commodity market remains sluggish.
\"In order to survive, we realize that we have to focus on narrow areas where we can differentiate ourselves with unique technologies,\" said Masaru Endoh, president of Ibiden . \".
The company applies its materials
How to make tiny circuit boards for early digital watches.
As it became better in preparing multi-layer devices from plastic resin, it turned to computer circuit boards.
The market is also destined to be part of a pile of goods, so Endu assigned 50 researchers in 1994 to complete a challenging task: double the cost of packaging plastic chipsthird. Which they did.
Ibendon began to scale.
Plastic microprocessor packaging was produced in 1996.
Goldman Sachs estimates that sales of these devices rose 74% to $0. 24 billion as of March 1998 (Japan).
Ibiden\'s success is a big blow to Kyocera, but the game is just beginning. Ibiden\'s pin-
The grid package plugs into the board with dozens of small pins.
Shinko and Johnson Mattel Electronics, from Nagano, Minneapolis, Minnesota, are selling a competitor\'s packaging style, replacing pins with metal balls.
The ball bag provides a short, comfortable connection for faster transmission.
Not competitors.
Regarding Shinko and Johnson Matthey, Endu is trying to surpass them by developing enough precise packaging to match tiny 0. 25-
Micron and smaller circuits-
From now on, Intel will launch products of all sizes.
This circuit will allow the microprocessor to manufacture commercial tiny tin balls to replace the precision bonding lines that connect the chip and the package.
To assemble these small animals, Ibiden developed its own plastic resin and developed a new process to build a plastic layer containing complex copper wiring patterns (see diagram).
In the words of Intel chairman Andy Grove, this is indeed a market where only paranoia can survive.
Kyocera and Johnson Mattel are hot on Ibiden\'s tail with a technique --
Like everyone else, share the deed.
But Ibiden may have more practice than they do in adapting to technological change.
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