High-power LED heatsink boosts space

by / Friday, 30 March 2018 / Published in Company Blog

Manufacturers are now more pursuing simple and easy-to-use products. Since it is a simple and easy project, the over-complexity of the kit will be difficult to achieve.

As we all know, heat to transfer has three major ways – conduction, convection, radiation. Let’s talk about the possible room for improvement in the design and application of high-power LED heatsinks.

Let’s take a look at the conduction, because such lamps generally do not directly contact the surrounding buildings themselves, so the conduction cannot directly ” dissipate ” the heat that produced by the light source and the power supply to the surrounding environment, but it is still extremely important, for it is the most direct way to take heat away from the light source. Early high-power LED heatsink designs often ignored this point and simply increased the fin area of ”the heatsink, ignoring that heat did not reach the fins at all. Therefore, the temperature of the fins of this type of heatsink is very low, as if the cool effect is outstanding, but in reality it does not play the role that the heatsink should have.

However, there are several problems that can cause major problems if not handled properly.

The first are the flatness of the contact surface. A little deformation will cause a significant reduction in the contact area between the aluminum substrate and the heatsink, which will have a significant impact on heat conduction.

Then the choice and use of medi. In fact, the choice and use of heat-conducting medium has a great influence on the heat dissipation of the lamp. Even if the contact surface has been processed, it is still not flat under the magnifying glass. The heat transfers medium fills the gap between the contact surfaces well. Since the thermal conductivity of air is actually as low as hesitating at only 0.024 W/mK, the locations that fail to directly contact or fill the heat transfer medium are almost thermally insulated.

Although many companies are filled with a heat transfer medium between the contact surfaces, for most of the heat transfer medium itself has poor fluidity, simply coating a thermal paste by human or mechanical connections does not work well, so the heat transfers medium is the thinner the better, the better to fill the gap. The ideal situation are to use a heat-conducting medium of 1.8 W/mK or more and use a stencil to ensure uniformity and thickness in order to fully utilize the heatsink itself.

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