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groovy gluing keeps computer chips cool

by:Mingfa Tech     2020-04-17
Duncan Graham
Researchers say that simply by improving the way different bits stick together can cool down the computer processor more effectively.
Keeping the chip cool is a major challenge to continuously improve processor performance, says Bruno Michel, who led the study at the IBM Zurich Research lab in Switzerland.
Currently, this involves connecting a piece of metal called a radiator to the surface of the chip.
This conducts heat out of the circuit and usually increases its surface area with fins.
These radiators are usually air. Cool with a fan.
However, Michelle and colleagues found that the paste used to connect the radiator to the chip was affected by unusual fluid dynamics during the attachment process, and more of them were along the X-
Shape between corners.
The problem arises when the radiator is applied to the chip.
\"When you squeeze the paste out of the gap, it always goes to the path with the least resistance, to the edge,\" said Michelle . \".
He explained that at the diagonal line, the force pushing it to both sides is equal, causing it to pile up along these lines.
This interferes with the heat transfer process, because it creates hot spots, and the thicker area of the paste cannot properly conduct heat, thus preventing the part of the chip from cooling effectively.
IBM\'s solution to this problem is a micron-level model.
Channel size below
The surface of the radiator.
They partnered with a company called Momentive Performance Materials to create a pattern network of channels of different sizes.
All in all, these channels are like irrigation systems for paste.
The model is designed to pull it out of areas that are usually formed, thus providing a more uniform distribution.
The test shows that this method reduces the thermal resistance of the pasting layer by more than three times, which means that the heat it retains is significantly reduced.
As a result, more heat is transferred to the sink and taken away by the fan. Bashir Al-
Hashimi of the University of Southampton electronic system design team in the UK says heat \"is a reliability problem to a large extent\" because components exposed to chips with more heat are more likely to failAl-
Hashimi sees IBM\'s approach as a simple and sensible solution to this problem.
To keep the power off and prevent overheating, space is often wasted on the chip, says Michelle. Using micro-
He suggested that channels can make more efficient use of space, thus helping to increase the speed of the processor. The micro-
Channels may begin to appear in chips in 2008.
This research is in IEEE half.
Therm seminar in San Jose, California, USA.
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